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iPad Pro M4芯片详细分析

M4芯片采用台积电第二代3纳米工艺制程，大核频率最高4.5GHz，小核2.88GHz，频率达到了intel Ultra5水平。GPU频率1.47Ghz，相比M3小幅提升。

CPU方面，大核解码单元从上代9宽提升至10宽，同时引入SME单元。SPEC 2017峰值性能测试大核整数性能较上代提升18.9%，浮点提升25.4%，为M系列提升最大一次，同时峰值功耗增加约60%。相比i9 14900K，M4大核4.5GHz下比intel 6GHz下高出23%！日常状态，IPC（分/GHz）大核较上代提升7.3%，小核8.6%。GeekBench 6测试单核4000分比至今未上市的高通X Elite高出1000分。GeekBench5结果单核大幅超越Ultra 9，多核接近Ultra9，超越R9-8954HS。

GPU方面则是常规成绩，较上代提升约10%，同时功耗提升约10%，侧面说明台积电新工艺并未带来能效提升。

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iPad Pro M4芯片详细分析

M4芯片采用台积电第二代3纳米工艺制程，大核频率最高4.5GHz，小核2.88GHz，频率达到了intel Ultra5水平。GPU频率1.47Ghz，相比M3小幅提升。

CPU方面，大核解码单元从上代9宽提升至10宽，同时引入SME单元。SPEC 2017峰值性能测试大核整数性能较上代提升18.9%，浮点提升25.4%，为M系列提升最大一次，同时峰值功耗增加约60%。相比i9 14900K，M4大核4.5GHz下比intel 6GHz下高出23%！日常状态，IPC（分/GHz）大核较上代提升7.3%，小核8.6%。GeekBench 6测试单核4000分比至今未上市的高通X Elite高出1000分。GeekBench5结果单核大幅超越Ultra 9，多核接近Ultra9，超越R9-8954HS。

GPU方面则是常规成绩，较上代提升约10%，同时功耗提升约10%，侧面说明台积电新工艺并未带来能效提升。

Geekerwan

关注频道 @ZaiHuaPd
频道投稿 @ZaiHuabot
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If riding a bucking bronco is your idea of fun, you’re going to love what the stock market has in store. Consider this past week’s ride a preview.The week’s action didn’t look like much, if you didn’t know better. The Dow Jones Industrial Average rose 213.12 points or 0.6%, while the S&P 500 advanced 0.5%, and the Nasdaq Composite ended little changed.

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The super secure UAE-based Telegram messenger service, developed by Russian-born software icon Pavel Durov, is looking to raise $1bn through a bond placement to a limited number of investors from Russia, Europe, Asia and the Middle East, the Kommersant daily reported citing unnamed sources on February 18, 2021.The issue reportedly comprises exchange bonds that could be converted into equity in the messaging service that is currently 100% owned by Durov and his brother Nikolai.Kommersant reports that the price of the conversion would be at a 10% discount to a potential IPO should it happen within five years.The minimum bond placement is said to be set at $50mn, but could be lowered to $10mn. Five-year bonds could carry an annual coupon of 7-8%.

Testflight 新闻投稿 中文 from hk


iPad Pro M4芯片详细分析M4芯片采用台积电第二代3纳米工艺制程，大核频率最高4.5GHz，小核2.88GHz，频率达到了intel Ultra5水平。GPU频率1.47Ghz，相比M3小幅提升。CPU方面，大核解码单元从上代9宽提升至10宽，同时引入SME单元。SPEC 2017峰值性能测试大核整数性能较上代提升18.9%，浮点提升25.4%，为M系列提升最大一次，同时峰值功耗增加约60%。相比i9 14900K，M4大核4.5GHz下比intel 6GHz下高出23%！日常状态，IPC（分/GHz）大核较上代提升7.3%，小核8.6%。GeekBench 6测试单核4000分比至今未上市的高通X Elite高出1000分。GeekBench5结果单核大幅超越Ultra 9，多核接近Ultra9，超越R9-8954HS。GPU方面则是常规成绩，较上代提升约10%，同时功耗提升约10%，侧面说明台积电新工艺并未带来能效提升。Geekerwan关注频道 @ZaiHuaPd频道投稿 @ZaiHuabot🫥会员/Apple/Plus券合集️

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